| ITEM | STANDARD | ADVANCED |
|---|---|---|
Minimum Line/Spacing, Internal | 3/3 | 3/3 |
Minimum Line/Spacing, External | 4/4 | 3/3 |
Minimum Drilled Hole Size | 8 | 6 |
Aspect Ratio (Thickness to Drill) | 10:1 | 15:1 |
Annular Ring (Diameter over Drill) | 10 | 8 |
Anti-pad (Diameter over Drill) | 20 | 16 |
Plated Hole Tolerance | ±3 | ±2 |
Minimum Dielectric Thickness | 3 | 2 |
Maximum PCB Thickness (inches) | 0.200 | 0.250 |
Thickness Tolerance (% of Thickness) | ±10 | ±7 |
Maximum PCB Dimensions (inches) | 16.0X22.0 | 30.0X44.0 |
Fabricated Dimensions -NC Routing | ±5mils | ±3mils |
Layer-to-Layer Registration Tolerance | ±5 | ±3 |
Solder Mask Clearance, Per Side | 2.0mils | 1.5mils |
Blind/Buried Vias (All Types) | yes | yes |
Via Fill (Conductive, Non-Conductive) | no | Yes |
| Inner Layers | STANDARD | ADVANCED |
|---|---|---|
Minimum Core thickness | 3 mils | 2 mils |
Minimum Line width | 4 mils | 3 mils (H Oz copper) |
Minimum Spacing (Air gap) | 4 mils | 3 mils (H Oz copper) |
Minimum pad size | Drill size+10 mils | Drill Size+7 mils |
Minimum Anti Pad (planes) | Drill Size+20 mils | Drill Size+16 mils |
| Outer Layers | STANDARD | ADVANCED |
|---|---|---|
Max. Finished Thickness | 0.200 | 0.250 |
Thickness Tolerance | ±10% | ±5% |
Max. Aspect Ratio | 10:1 | 12:1 |
Min. Drill Size | 10 | 8 mils |
Min. Line width | 4 mils | 3 mils |
Min. Spacing (air gap) | 4 mils | 3 mils |
Min. Solder mask clearance | 4 mils | 3 mils |
Min. solder mask web thickness (mask between pads) | 4 mils | 3.4 mils |
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