As PCBs continue to shrink in size and grow in complexity, it’s essential for your PCB fabricator to adapt. As a designer, you know that traditional processes are constantly evolving, with new techniques emerging to meet the demands of High-Density Interconnect (HDI) technology. At Stream PCB, we are committed to staying ahead of the curve!
HDI is one of our specialties, and it goes beyond just fine lines in the foil pattern. It also involves Sequential Build-Up (SBU) and the use of laser-drilled Microvias, ensuring that your designs are innovative and meet the latest industry standards.
Multilayer technology utilizing Sequential Build-Up (SBU) involves adding one layer of dielectric and foil pattern at a time, allowing for the processing of HDI Micro-Vias before adding the next layer.
These layers are added in pairs, one on each side of the substrate, to balance the stresses. For instance, layers can be added in increments such as 1, 2, 3, etc., on each side of the substrate (N), or in a pattern like 1+N+1, 2+N+2, 3+N+3, and so on.
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