Surface Finish

HASL (Hot Air Solder Leveling)

Solder is applied to exposed features, with thickness varying between 0.2 to 1.2 mils depending on board design and density. The solder is a 63% tin and 37% lead allo

OSP (Organic Solderability Preservative)

A thin, transparent organic layer is applied to exposed copper features to protect them from oxidation before soldering.

ENIG (Electroless Nickel Immersion Gold)

A layer of nickel (80-150 micro inches) followed by a thin layer of gold (3-6 micro inches) is deposited on exposed features, providing excellent solderability and corrosion resistance.

Gold Flash

Electrolytic nickel (150-200 micro inches) and hard gold (5-10 micro inches) are plated onto solderable features, often used for connectors and high-reliability applications.

Immersion Silver

A thin layer of silver (4-20 micro inches) is deposited on exposed features, offering good solderability and a flat surface for fine-pitch components.

Immersion Tin

A layer of tin (30-40 micro inches) is applied to exposed features, providing a flat surface and good solderability, often used for high-density designs

Carbon Ink (Keypad Application)

A conductive carbon paste is selectively applied to pads for contact purposes, commonly used in devices like calculators or remote controls.

Wire Bondable Soft Gold

Electrolytic soft gold (20-50 micro inches) is plated on features requiring wire bonding, with a nickel underlayer (150-250 micro inches) for durability and adhesion.