Flex capability hinges on material selection, process tolerances, manufacturing logistics, and partnering with the right flex supplier to ensure cost-effective and reliable flex circuit designs. At Stream PCB, we specialize in design-for-manufacturing (DFM) strategies to minimize program costs while maintaining quality. Our expertise includes working with standard materials and capabilities, as well as accommodating tighter tolerances or specialized process treatments tailored to your design needs.
With over a decade of experience, flex PCB manufacturing is at the core of our business. Whether you need quick-turn prototypes, high-volume production runs, simple breakout boards, or complex Microwave/RF designs, we offer flexible solutions to meet your requirements. Trust Stream PCB to deliver precision and reliability for your flex PCB needs.
| Polyimide Thickness | 0.0005” (12 µm), 0.001” (25 µm), 0.002” (50 µm), 0.003” (75 µm), 0.005” (125 µm) |
|---|---|
Copper (thickness) | 0.25 oz. (9 µm), 0.33 oz. (12 µm), 0.5 oz. (17 µm), 1 oz. (35 µm), 2 oz. (70 µm) |
Copper Foils (rolled-annealed) | Polyimide, Polyester, LPI (liquid photo imageable), PIC (photo imageable cover coat) |
Stiffeners | FR-4, Polyimide, Metal, or customer supplied |
Thermo-bond Adhesives | Acrylic, Phenolic Butyral, Modified Epoxy |
Surface Finishes | Solder (hot air leveling or tin/lead plating), Electrolytic Soft Bondable Gold, Hard Gold, ENIG (electroless nickel immersion gold), Entek 106A, & Immersion Tin |
| Minimum Trace/Space: | 0.0015″ / 0.002″ (0.33 oz.) 0.002″ / 0.0025″ (0.5 oz.) 0.003″ / 0.0035″ (1 oz.) |
|---|---|
Minimum Via Hole Diameter (Before Plating): | 0.006″ (NC Drill)
0.002″ (UV Laser) |
Minimum Blind Via Diameter (Before Plating): | 0.004″ (UV Laser) |
Trace to Edge Distance | 0.010″ (NC Route)
0.008″ (Die Punch)
0.001″ (UV Laser)* |
Trace to Edge Tolerance: | 0.005″ (NC Route)
0.003″ (Die Punch)
0.001″ (UV Laser) |
Cover Layer Aperture Positional Tolerance: | 0.005″ (Cover Film)
0.002″ (LPI and PIC)
0.001″ (Laser Ablation)* |
Maintain a minimum 0.003″ trace-to-edge distance for proper copper insulation. Laser-defined apertures are created through cover layer ablation.
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