At times, BGA assemblies require modifications or rework to maintain optimal performance. With extensive expertise in BGA rework, StreamPCB ensures precision and reliability throughout the process.
Reworking and/or Replacing a BGA
When reworking solder connections beneath a BGA, precise heat application is crucial. The goal is to reflow the solder without affecting the PCB or surrounding components.The process begins with preheating the PCB to prevent thermal shock. Once the board reaches the required temperature, controlled heat is applied to the BGA, allowing the solder to melt. The BGA is then carefully removed.If the BGA is to be reused, it undergoes a reballing process. Old solder is removed, and new solder balls are attached to the BGA. The re-balled component is then placed back onto the PCB assembly.Following another preheating phase, the PCB reaches the correct temperature, and the BGA is given additional heat to reflow the solder and form secure connections.Once the rework is complete, the PCB undergoes cleaning and thorough inspection before being shipped.For expert Ball Grid Array rework, reach out to us at sales@streampcb.com or call 1-408-982-5851.
