Capabilities: Flex and Rigid Flex

Material:

• Flex:L2~L3 TU-768:L1~L0 L0~L4
• Laser:L4~L0 laser via:0.006″
• Dielec tricthickness: 0.0035″~0.0045″
•  No VIPPO

• PI thic:1~3mils
• Coverlay thic:2mils
• Ink thic:0.5~0.9mils
• Adhesive thic:1~2mils (Polyester)
• Nonflow PP 47N 49N thic:2.5mils
• Stiffener PI FR4 AL
• Copper ED RA
• EMI SF-PC5500 thic:0.6~0.8mils
• Cu + adhesive thic:2.4mils

• Copper windowing
• Laser via
• Copper plating
• Coverlay/Soldermask
• Fab.: CNC, Laser cutting
• Stiffener

Precision Hot-Air Oven

LDI

Laser Cutting

MASS. LAM. For Flex And Cover Lay