HDI CAPABILITIES – more details – Stream PCB

HDI Technology in Hole

HDI Technology in Hole

High Density Interconnection

High Density Interconnection

Blind & Burried 9+2+9 Laser Drill

Blind & Burried 9+2+9 Laser Drill

Market Trend vs. Technology Solution

Market Trend vs. Technology Solution

HDI Process Flow

HDI Process Flow

Main Process of Build – up Layer

Main Process of Build – up Layer

Construction Materials

Construction Materials

Material Type

Comparison of Material

Comparison of Material

	Prepreg	RCC
Low Cost	++	-
Strength	++	+
Hole wall roughness	-	+
Laminating control	+	-
Dielectric thickness	45um ~	30um ~ 80um
Smear residue on target pad	-	++
Dielectric constant	3.9 ~ 4.7	3.2 ~ 3.8
Shelf time	++	+
Working PNL size	++	+

Comparison of Via Technologies

Comparison of Via Technologies

	Mechanical Drilling	Laser Drilling
Low Cost in Equipment	++	+
Low Cost in Production	+	++
Required Facilities	Drilling Machine	Laser Machine
Consumable	Drill Bits, Backup Board	None
Aspect Ratio	9	1
Via Size Capacity	200 um~	50~100um
Speed	140 H/min	20,000 H/min
Throughput	-	+

Comparison of Blind Via

Comparison of Blind Via

Prepreg

RCC

Build-up for 2 + N + 2

Build-up for 2 + N + 2

Through Hole

Inner Laser Via

Stack Hole

Inner Via Hole

Surface Laser Via

Laser Via Quality

Laser Via Quality

1+6+1 without buried, extend to 1+N+1

1+6+1 without buried, extend to 1+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

Black Oxide Treatment

Black Oxide Treatment

D.F. Strip

D.F. Strip

Dry film, Exposure & DES

Dry film, Exposure & DES

Black Oxide Treatment

Black Oxide Treatment

Etching

Etching

Prepreg Layup

Prepreg Layup

Dry Film Lamination

Dry Film Lamination

Electro Plating

Electro Plating

D.F. Exposure / Developing

D.F. Exposure / Developing

Solder Mask Printing

Solder Mask Printing

2+4+2 laser via on laser via

2+4+2 laser via on laser via

2+4+2 Staggered via, extend to 2+N+2

2+4+2 Staggered via, extend to 2+N+2

2+4+2 Staggered via, extend to 2+N+2

2+4+2 Staggered via, extend to 2+N+2

Lamination

Lamination

I.V.H.(Inner Via Hole) Drilling

I.V.H.(Inner Via Hole) Drilling

Blind via Capability

Blind via Capability

I.V.H.(Inner Via Hole) Drilling

I.V.H.(Inner Via Hole) Drilling

I.V.H.(Inner Via Hole) Drilling

I.V.H.(Inner Via Hole) Drilling

Electroless Copper Plating

Electroless Copper Plating

I.V.H.Grinding ( for thickness >= 60 mil )

I.V.H.Grinding ( for thickness >= 60 mil )

Electro Plating

Electro Plating

Dry Film Lamination

Dry Film Lamination

D.F. Exposure / Developing

D.F. Exposure / Developing

I.V.H.Grinding ( for thickness >= 60 mil )

Inner Via Hole Plugging ( for thickness >= 60 mil )

Desmear / Electroless Copper Plating

Desmear / Electroless Copper Plating

Laser Drilling for Blind Via

Laser Drilling for Blind Via

D.F. Strip

D.F. Strip

Etching

Etching

D.F. Exposure / Developing

D.F. Exposure / Developing

S/M Exposure / Developing

S/M Exposure / Developing

Surface Finish

Surface Finish

Symbol Mask Printing

Symbol Mask Printing

Inspection

Inspection

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